Amaoe Qualcomm bga stencil 0.12mm for precision ic reballing
During Qualcomm IC reballing, inaccurate hole alignment or incorrect stencil thickness often causes uneven solder balls, short circuits, or weak joints. Generic stencils fail to match IC layouts, leading to repeated rework and wasted time. The Amaoe U QSD12 0.12mm BGA Reballing Stencil is designed to solve this problem by providing accurate pad layouts for multiple Qualcomm chipset series. Its precise hole alignment and controlled thickness help technicians achieve uniform solder ball formation. Technicians trust this stencil because it improves reballing success rate, reduces IC damage risk, and delivers consistent results in professional motherboard repair.
Key Features
- Designed for Qualcomm series IC reballing
- 0.12mm stencil thickness for controlled solder volume
- Precision laser cut holes for accurate ball placement
- Supports multiple Qualcomm chipset layouts on one stencil
- Durable metal construction for repeated professional use
- Helps reduce solder bridging and uneven joints
Specification Key
| Parameters | Details |
|---|
| Brand | Amaoe |
| Model | U QSD12 |
| Stencil Type | BGA reballing stencil |
| Thickness | 0.12 mm |
| Supported IC Series | Qualcomm series as marked |
| Material | Metal stencil |
| Application | IC reballing and motherboard repair |
Supported IC Model Numbers
- SM7635
- SM7550
- SM6450
- SM4450
- Gen7s
- Gen7
- Gen6
- Gen5
- Gen4
- Gen2
Usage Benefit
- Ensures accurate solder ball placement
- Improves IC reballing success rate
- Saves time during Qualcomm chipset repair
- Reduces repeat rework and IC failure
- Suitable for professional motherboard technicians
Installation Tips
- Clean IC surface thoroughly before reballing
- Align stencil accurately with IC pads
- Use correct solder ball size for 0.12mm stencil
- Apply even heat during reballing
- Allow IC to cool before stencil removal
Product Package
FAQs
- Q1. Why this stencil is needed for Qualcomm IC repair
- Qualcomm ICs require precise pad alignment and controlled solder volume, which this stencil provides.
- Q2. What thickness is this stencil
- This stencil has a 0.12mm thickness.
- Q3. Does this support multiple IC models
- Yes, it supports multiple Qualcomm IC layouts as printed on the stencil.
- Q4. Is this suitable for professional reballing work
- Yes, it is designed for repeated professional motherboard repair use.
- Q5. What happens if wrong stencil thickness is used
- Incorrect thickness can cause solder bridging or weak solder joints.
