Id: 4507
- Item Code/Product Code: U-QSD6
- Weight: 0.05kg
- SKU: 52096
This offer ends in:
AMAOE U QSD6 0.12mm Precision Stencil For Qualcomm PM And Baseband ICs
The AMAOE U-QSD6 Universal BGA Reballing Stencil is engineered for precise reballing of Qualcomm power management and baseband ICs. With a 0.12mm stainless steel thickness, it delivers consistent solder volume, accurate pad alignment, and reliable results during chip-level motherboard repair. This stencil is designed for technicians who regularly work on Snapdragon-based devices and require one stencil to cover multiple IC layouts. Technicians often struggle with uneven solder balls and pad shifting when reballed PM or RF ICs fail to align correctly. The U-QSD6 solves this by providing clearly defined, laser-cut patterns that match real Qualcomm IC footprints. This improves reballing success rate, reduces IC damage, and minimizes repeat work on high-value motherboards.
Features
- 0.12mm thickness for controlled solder ball height
- Universal Qualcomm IC coverage on one plate
- High-precision laser cut holes
- Stable stainless steel construction
- Optimized for PM, RF, and baseband ICs
- Clear IC marking for quick identification
- Reusable with proper cleaning
Specification Key
| Parameters | Details |
|---|---|
| Brand | AMAOE |
| Model | U-QSD6 |
| Stencil type | Universal BGA reballing stencil |
| Thickness | 0.12mm |
| Material | Stainless steel |
| IC type | Qualcomm PM, RF, Baseband |
| Cutting method | Laser precision |
| Application | Chip-level motherboard repair |
Model numbers supported
- PM8005
- PM845
- PM8150
- PM8150A
- PM8150B
- PM7150
- PM7150A
- PM8998
- SM8150
- SM7150
- SDR660
- SDR845
- SDM845
- RAM556
- PX8368WM
- WCD9340
- WCN3990
- SMB1390
- QM57016
- BGA254 layouts
Benefits
- Ensures uniform solder ball formation
- Reduces bridging and cold joints
- Saves time by covering multiple ICs
- Improves alignment during hot air reflow
- Suitable for professional repair labs
Installation tips
- Clean IC pads thoroughly before reballing
- Use correct solder ball size for 0.12mm stencils
- Fix stencil firmly to prevent movement
- Apply even heat across the stencil
- Let solder cool before stencil removal
Package content
- 1 x AMAOE U-QSD6 BGA Reballing Stencil
Faqs
- Q1. What thickness is this stencil?
- This stencil uses a 0.12mm thickness for precise solder control.
- Q2. Is it model-specific or universal?
- It is universal, covering multiple Qualcomm IC models on one stencil.
- Q3. Can beginners use this stencil?
- Recommended for experienced technicians due to dense BGA patterns.
- Q4. Is it reusable?
- Yes, if cleaned properly after each use.
- Q5. Which repair jobs is it best for?
- PM IC, RF IC, and baseband IC reballing on Qualcomm platforms.
