Luowei SP3 183°C Black Small Can Anti-Oxidant Solder Paste 30g

Luowei SP3 Black Anti-Oxidation Solder Paste 30G for Mobile Motherboard Repair

Poor-quality solder paste often leads to weak solder joints, excessive residue, oxidation problems, poor tin flow, and unstable repair results. During motherboard and micro-soldering work, technicians need a reliable solder paste that provides smooth soldering performance and consistent joint quality. The Luowei SP3 199°C Black Anti-Oxidation Solder Paste 30G is specially formulated for precision electronic repairs, motherboard rework, jumper wire soldering, IC soldering, and BGA repair applications. Its anti-oxidation formula helps improve soldering efficiency while reducing oxidation during heating. Designed for professional repair technicians, the SP3 solder paste offers stable performance, smooth solder flow, strong adhesion, and clean solder joints, making it suitable for mobile phone repair, electronic maintenance, and precision circuit board work.

Features

• 199°C low-temperature soldering formula
• Black anti-oxidation solder paste
• Smooth and uniform solder flow
• Strong solder joint formation
• Low residue after soldering
• Suitable for precision motherboard work
• Stable performance during heating
• Professional repair-grade formulation

Specification

Benefits or Usage

• Helps create strong solder joints
• Reduces oxidation during soldering
• Suitable for BGA and IC rework
• Supports precise motherboard repairs
• Improves soldering efficiency
• Minimizes soldering defects
• Suitable for jumper wire work
• Ideal for professional repair environments

Supported Applications

• Mobile Phone Motherboard Repair
• IC Reballing Work
• BGA Rework Applications
• CPU & NAND Repairs
• Jumper Wire Soldering
• PCB Repair & Maintenance
• Electronic Circuit Repair
• Precision Micro-Soldering

Usage Tips

• Apply a small amount before heating.
• Store in a cool and dry environment.
• Keep container tightly sealed after use.
• Use appropriate soldering temperature.
• Avoid contamination during application.
• Clean repair area before soldering.
• Use with professional repair equipment.
• Keep away from direct sunlight.

Package Content

• 1 × Luowei SP3 199°C Black Anti-Oxidation Solder Paste 30G

FAQs

• Q1. What is Luowei SP3 solder paste used for?
• It is used for motherboard repair, IC soldering, BGA rework, jumper wire repair, and precision electronic maintenance.
• Q2. What is the melting point of Luowei SP3?
• The Luowei SP3 solder paste features a low-temperature 199°C melting point for efficient repair work.
• Q3. Is this solder paste suitable for mobile motherboard repair?
• Yes, it is specifically suitable for smartphone motherboard repairs, IC work, and micro-soldering applications.
• Q4. What makes the anti-oxidation formula beneficial?
• The anti-oxidation formula helps improve solder flow, reduces oxidation during heating, and supports stronger solder joints.
• Q5. How much solder paste is included?
• The package contains 30 grams of Luowei SP3 Black Anti-Oxidation Solder Paste.