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MaAnt Universal Black BGA Reballing Stencil

MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
New -34 %
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil
MaAnt Universal Black BGA Reballing Stencil

  • Product Id: 4765

  • Item Code/Product Code: BLK Universal Stencil
  • Weight: 0.15kg
  • SKU: 54547
MaANT MaANT
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₹199.00
₹300.00
Ex Tax: ₹199.00
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MaAnt Universal Black BGA Reballing Stencil

The MaAnt Universal Black BGA Reballing Stencil is a professional-grade universal stencil developed for accurate CPU, IC, NAND, UFS, eMMC, and motherboard reballing. Designed with MaAnt's Spider Web precision mesh layout, this stencil combines multiple popular mesh sizes into one compact plate, allowing technicians to perform high-quality solder ball implantation without changing multiple stencils.

Manufactured from premium stainless steel with precision laser-etched openings, it delivers excellent heat resistance, dimensional accuracy, and long service life. Whether you're repairing smartphones, tablets, or advanced electronic motherboards, this universal stencil provides consistent solder ball alignment and professional reballing results.

Key Features

Original MaAnt Universal Black Spider Web BGA Reballing Stencil.
Premium precision stainless steel construction.
Multiple universal mesh sizes integrated into one stencil.
Suitable for CPU, NAND, UFS, eMMC and various IC reballing.
High-precision laser etched openings for accurate solder ball placement.
Excellent heat resistance with minimal deformation.
Durable black coated finish for long-term professional use.
Integrated Spider Web mesh layout for multiple repair applications.
Includes Ant Standard positioning guides.
Features Square Chamfer alignment sections.
Ideal for professional motherboard repair technicians.
Reusable design suitable for daily repair work.

Technical Specifications

BrandMaAnt
Product NameUniversal Black Spider Web BGA Reballing Stencil
MaterialHigh Precision Stainless Steel
ColorBlack
DesignSpider Web Multi-Function Mesh
Stencil TypeUniversal BGA Reballing Stencil
Mesh SizesMultiple Built-in Precision Grid Sizes
Special FeaturesSquare Chamfer & Ant Standard Alignment Guides
ApplicationCPU, IC, NAND, UFS, eMMC & Motherboard Reballing

Available Mesh Sizes

0.35 × 32 × 32
0.35 × 35 × 35
0.35 × 48 × 48
0.35 × 50 × 50
0.40 × 32 × 32
0.40 × 48 × 48
0.40 × 50 × 50
0.42 × 25 × 25
0.50 × 38 × 38

Applications

CPU reballing.
eMMC IC repair.
UFS storage chip reballing.
NAND Flash IC repair.
PMIC solder ball replacement.
Mobile motherboard repair.
Tablet PCB repair.
BGA chip maintenance.
Micro soldering laboratories.
Professional electronics repair centers.

Why Choose the MaAnt Universal Black Stencil?

Instead of purchasing multiple individual reballing stencils, the MaAnt Universal Black Spider Web Stencil combines several commonly used BGA mesh patterns into a single precision-engineered plate. Its laser-cut stainless steel construction ensures consistent solder ball positioning while resisting warping during repeated heating cycles. The integrated Square Chamfer and Ant Standard alignment areas further improve positioning accuracy, making this stencil an excellent choice for technicians performing advanced motherboard, CPU, UFS, and IC-level repairs on modern smartphones and electronic devices.

Package Includes

1 × MaAnt Universal Black Spider Web BGA Reballing Stencil

Frequently Asked Questions (FAQs)

It is designed for universal BGA reballing of CPU, UFS, eMMC, NAND Flash, PMIC and various mobile motherboard ICs.
Yes. It is specifically developed for professional smartphone and tablet motherboard repair work.
Yes. The premium stainless steel construction allows repeated professional use without losing precision.
Yes. Multiple popular BGA grid sizes are integrated into one Spider Web stencil, reducing the need for separate stencil plates.
The stencil is designed for technicians familiar with BGA reballing, motherboard repair, and precision micro soldering.

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Tags: MaAnt , Universal Black Stencil , Spider Web Stencil , BGA Reballing Stencil , CPU Reballing ,

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