Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra-thin 0.08mm thickness, this stencil ensures perfect solder ball
alignment, making it an essential tool for professional microsoldering
technicians, phone repair shops, and electronics engineers.
Features:
- Material: High-Quality Stainless Steel
- Thickness: 0.08mm (Ultra-Thin for Precision)
- Compatibility: iPhone 12 Pro Max BGA Chips (CPU, NAND, Baseband, etc.)
- Finish: Smooth Laser-Cut Edges (No Burrs)
- Usage: Reballing, Reflow, Solder Ball Replacement
Package Included:
- 1 × Amaoe 0.08MM BGA Reballing Stencil for iPhone 12 Pro Max
