NEXST U-SMU2 CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS - 0.12MM

Nexst U-Smu2 Cpu Bga Reballing Stencil For Samsung Exynos

Features :

1. Brand New.
2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh

Advantage:
1. Deformation Resistant Material
2. Precise Pins Location
3. Square Round Hole
4. Good Material

Model Numbers Supported ;

1. EXYNOS 9610
2. EXYNOS 9611
3. EXYNOS 9609
4. EXYNOS 850
5. EXYNOS 3830
6. EXYNOS 7884
7. EXYNOS 7885
8. EXYNOS 7904
9. EXYNOS 9610
10. EXYNOS 9611 RAM
11. EXYNOS 880
12. EXYNOS 980
13. EXYNOS 1280
14. EXYNOS E8825
15. EXYNOS 7884
16. EXYNOS 7885
17. EXYNOS 7904 RAM

Package Content*

1 X Nexst U-SMU2 Stencil.